Small Pitch BGA PCB AssemblyLayer count: 6 Layer HDI PCBMaterial: FR4, TG170 , 1.6 mm, basic copper 0.5 OZ for all layerMinimum tack: 2.5 milMinimum space(gap): 2.5 milMinimum hole: 0.15mmBuy Now: tinyurl.com/2htdk85d
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